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Doing the great thermostat renaming. #30758
Doing the great thermostat renaming. #30758
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PR #30758: Size comparison from 223c054 to 6f28051 Increases above 0.2%:
Increases (15 builds for linux, nrfconnect, psoc6, telink)
Decreases (7 builds for efr32, linux, nrfconnect, telink)
Full report (70 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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PR #30758: Size comparison from 223c054 to 2a149a6 Increases (3 builds for nrfconnect)
Decreases (3 builds for nrfconnect)
Full report (8 builds for cc32xx, mbed, nrfconnect, qpg)
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PR #30758: Size comparison from 223c054 to 722508a Increases above 0.2%:
Increases (17 builds for esp32, linux, nrfconnect, psoc6, telink)
Decreases (9 builds for efr32, esp32, linux, nrfconnect, telink)
Full report (72 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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PR #30758: Size comparison from 516f918 to 29740d9 Full report (5 builds for cc32xx, mbed, qpg)
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Co-authored-by: Boris Zbarsky <[email protected]>
Co-authored-by: Boris Zbarsky <[email protected]>
PR #30758: Size comparison from 516f918 to fce08ea Increases above 0.2%:
Increases (17 builds for esp32, linux, nrfconnect, psoc6, telink)
Decreases (9 builds for efr32, esp32, linux, nrfconnect, telink)
Full report (72 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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PR #30758: Size comparison from 516f918 to b4ba301 Increases above 0.2%:
Increases (17 builds for esp32, linux, nrfconnect, psoc6, telink)
Decreases (8 builds for efr32, esp32, linux, nrfconnect, telink)
Full report (72 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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PR #30758: Size comparison from 516f918 to ebbf1b8 Increases above 0.2%:
Increases (41 builds for bl602, bl702, bl702l, esp32, linux, nrfconnect, psoc6, telink)
Decreases (11 builds for bl702l, efr32, linux)
Full report (72 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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Requesting changes, pending review from @bzbarsky-apple, this breaks public API as is.
After further inspection, maybe it looks OK! Would like @bzbarsky-apple to review though. |
the test suite to fail when writing to them. Temperature is the only type defined in chip-types.xml as signed (even signed int's aren't) and it looks like the min/max checking in attribute-table.cpp didn't like that.
src/app/zap-templates/zcl/data-model/chip/thermostat-cluster.xml
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src/app/zap-templates/zcl/data-model/chip/thermostat-cluster.xml
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src/app/zap-templates/zcl/data-model/chip/thermostat-cluster.xml
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src/app/zap-templates/zcl/data-model/chip/thermostat-cluster.xml
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Approved, modulo the remaining nits.
My issues have been addressed, dismissing Justin's "changes requested"
Co-authored-by: Boris Zbarsky <[email protected]>
PR #30758: Size comparison from 1583a24 to c9823f6 Increases above 0.2%:
Increases (17 builds for esp32, linux, nrfconnect, psoc6, telink)
Decreases (2 builds for efr32, linux)
Full report (72 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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Doing a separate PR for just the renames of types. This brings the cluster in line with the current version of the spec in master.