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Marlin 2.0.8 Firmware configured for FLSUN Super Racer with MKS Robin Nano V3 motherboard. Based on FLSUN sources.

Downloads:

• Firmwares for Super Racer Stock are available in here.
• Firmwares for Super Racer + Bondtech LGX Lite are available at the bottom of the page.

Main features:

• MKS Robin Nano V3 motherboard support
• TMC2209 / TMC2226 UART drivers support
• Nozzle & Bed PID support
• Enabled thermal protection for Nozzle & Bed
• Bed Leveling Bilinear 9 x 9 point support
• Nozzle Park / Advanced Pause support with improved position
• Babystepping with Combine Z-Offset support
• EEPROM support
• S-Curve Acceleration support
• Bed Skew Compensation support (https://www.thingiverse.com/thing:2563185)
• Delta Diagonal Rod Trim adjustments support
• G26 - Mesh Validation Pattern support
• G33 - Delta Auto Calibration support
• Enabled StealthChop for extruder
• Disabled Power Loss Recovery because not correctly implemented, repeated writes to the EEPROM are performed. Not good for EEPROM.
• Binary file transfert support to transfer and update the firmware remotely
• Enabled host prompt support
• Enabled Firmware Info with M115
• Enabled monitor for TMC drivers
• Enabled M106 to report the new fan speed when changed
• Improved probing speed
• Improved buffer size
• Fix TMC drivers settings
• Disabled not used settings

Installation procedure:

• Do an EEPROM reset before flashing the new firmware (command M502 followed by command M500 in a terminal or with the TFT screen).
• Restart the printer.
• Choose version you want here, SDCARD to use microSD Card port or USB to use USB port.
• Copy Robin_nano_v3.bin file to the root of the microSD card (max capacity 32GB, formatted in FAT32, allocation unit size 4096).
• With printer off, insert the microSD card into the dedicated port on the motherboard and turn on the printer.
• Flash procedure starts (without displaying anything on the screen) and lasts a few seconds.
• Check contents of the microSD card, Robin_nano_v3.bin file has been renamed to ROBIN_NANO_V3.CUR which indicates that the flash was successful.
• It's possible after flash you loose text on TFT screen, select your language again and save.
• Do an EEPROM reset again (command M502 followed by command M500 in a terminal or with the TFT screen).
• Restart the printer.
• To disable redundant "Not SD printing" commands:
  • M27 S0
• Launch a Nozzle PID in a terminal:
  • M303 E0 S220 C8
  • Retrieve the values Kp, Ki and Kd then:
  • M301 PKp IKi DKd
  • Then M500 to save.
• Launch a Bed PID in a terminal:
  • M303 E-1 S90 C8
  • Retrieve the values Kp, Ki and Kd then:
  • M304 PKp IKi DKd
  • Then M500 to save.
• Launch an extruder calibration in a terminal:
  • Heat your hotend to its usual operating temperature :
  • M109 Sxxx where xxx is temperature
  • Make a pencil mark at 120mm on the filament from the hole on the top of the printer (where we insert the filament)
  • M83 to switch to relative mode.
  • G1 E100 F100 for extruding 100mm.
  • Wait until the end of the extrusion and measure if there is still 20mm of the line on the filament until the filament inlet otherwise apply this calculation:
    • To obtain extrusion length: 120 - (value measured between the line and the filament inlet)
    • To obtain number of steps to have extruded 100mm: (value of E-steps/mm) x 100. Default E-Steps value is 415.
    • To obtain the new E-steps/mm: (number of steps to have extruded 100mm) / (extrusion length)
  • M92 E(new E-steps/mm)
  • Then M500 to save.
• Launch a Delta Calibration a wait until end of process :
  • Make sure to connect bed level probe before to start the following command.
  • G33
  • Then M500 to save.
• Start auto-leveling from the TFT screen menu and adjust Z-Offset. Don't forget to save.
• Perform a full format of your SD card (not a quick format) to avoid problems afterwards.
• If you want more precision or solve dimension problems, follow the instructions in this Excel file: Delta Calibration Calculator.zip

Link for a terminal: Printrun (ex Pronterface)

Screen firmware:

This Marlin firmware also requires updating the screen firmware, follow these instructions :

• Format microSD to FAT32 with allocation unit size to 4096.
• Extract screen firmware zip file here : Screen Firmware V1.3 Stock from FLSUN and copy DWIN_SET folder to the root of the microSD card.
• Turn off printer.
• Remove the screen cover and insert the card into the microSD slot.
• Turn on the printer.
• Screen firmware installation begins immediately, you will see several scrolling lines.
• When the END ! appears on the screen, turn off printer and remove the microSD card.
• Installation is complete, you can replace the screen cover and turn the printer back on.

Possible changes:

If you need to make any changes in sources files, please read this for compilation: here

Use VSCode et PlatformIO for compilation (see here).

• If you want to use microSD port, set these values:

  • In Configuration_adv.h: //#define USB_FLASH_DRIVE_SUPPORT
  • In Configuration_adv.h: //#define USE_OTG_USB_HOST

• If you want to use USB port, set these values :

  • In Configuration_adv.h: #define USB_FLASH_DRIVE_SUPPORT
  • In Configuration_adv.h: #define USE_OTG_USB_HOST

• If Trianglelab CHC Pro (104NT-4-R025H42G) HEATBLOCK, set these values:

  • In Configuration.h: #define TEMP_SENSOR_0 5
  • In Configuration.h: #define DEFAULT_Kp 13.0091
  • In Configuration.h: #define DEFAULT_Ki 1.9370
  • In Configuration.h: #define DEFAULT_Kd 21.8422

• If you have SKR 1.3 motherboard, set these values:

  • In platformio.ini: default_envs = LPC1768
  • In Configuration.h: #define MOTHERBOARD BOARD_BTT_SKR_V1_3
  • In Configuration.h: #define SERIAL_PORT -1
  • In Configuration.h: #define SERIAL_PORT_2 0
  • In Configuration_adv.h: #define E0_AUTO_FAN_PIN P2_04

• If you have OMG-V2-S EXTRUDEUR (BOWDEN), set these values:

  • In Configuration.h: #define DEFAULT_AXIS_STEPS_PER_UNIT { 80, 80, 80, 385 }
  • In Configuration.h: #define INVERT_E0_DIR true
  • In Configuration_adv.h: #define E0_CURRENT 1050

• If you have BONDTECH LGX EXTRUDEUR (BOWDEN), set these values :

  • In Configuration.h: #define DEFAULT_AXIS_STEPS_PER_UNIT { 80, 80, 80, 400 }
  • In Configuration.h: #define INVERT_E0_DIR false
  • In Configuration_adv.h: #define E0_CURRENT 650

• If you have BONDTECH LGX LITE EXTRUDEUR (DIRECT DRIVE), set these values:

  • In Configuration.h: #define DEFAULT_AXIS_STEPS_PER_UNIT { 80, 80, 80, 562 }
  • In Configuration.h: #define INVERT_E0_DIR false
  • In Configuration.h: #define DEFAULT_MAX_FEEDRATE { 200, 200, 200, 120 }
  • In Configuration.h: #define DEFAULT_MAX_ACCELERATION { 6000, 6000, 6000, 1500 }
  • In Configuration.h: #define DEFAULT_ACCELERATION 2500
  • In Configuration.h: #define DEFAULT_RETRACT_ACCELERATION 2000
  • In Configuration.h: #define DEFAULT_XJERK 10.0
  • In Configuration.h: #define DEFAULT_YJERK 10.0
  • In Configuration.h: #define DEFAULT_ZJERK 10.0
  • In Configuration.h: #define DEFAULT_EJERK 2.5
  • In Configuration_adv.h: #define E0_CURRENT 650
  • In Configuration_adv.h: #define FILAMENT_CHANGE_UNLOAD_LENGTH 70
  • In Configuration_adv.h: #define FILAMENT_CHANGE_FAST_LOAD_LENGTH 70
  • In Configuration_adv.h: //#define STEALTHCHOP_E

• If you have Trianglelab CHC Pro (104NT-4-R025H42G) HEATBLOCK, set these values:

  • In Configuration.h: #define TEMP_SENSOR_0 5
  • In Configuration.h: #define DEFAULT_Kp 13.0091
  • In Configuration.h: #define DEFAULT_Ki 1.9370
  • In Configuration.h: #define DEFAULT_Kd 21.8422

Firmware for Bondtech LGX Lite:

Files and materials needed:

	LGX Lite Support	- Requires 2 x M3x12 screws to secure the LGX Lite to the bracket - Using stock screws to secure everything - Requires 2 x 5015 fans (optional) - Requires 2 x M3x16 screws for 5015 fans (optional) - Requires 2 x M3x20 screws for 5015 fans (optional)
	Filament Sensor Mount.zip	- Using stock screws
	Cable Guide.zip	- N/A

Firmwares for LGX Lite ONLY are available here (Updated 03/11/2022):

• SDCARD version
• USB version

Recommanded retraction:

• Distance : 1.2 mm
• Speed : 35 mm/s

Don't forget to reset EEPROM after flash !