HM-11-MODULE.kicad_mod

(module HM-11-MODULE (layer F.Cu) (tedit 54BF79F9)
  (descr "Chinese HM-11 Bluetooth Low Energy module -- Phillip Pearson")
  (fp_text reference HM-11-MODULE (at -0.25 -7.75) (layer F.SilkS)
    (effects (font (size 1.5 1.5) (thickness 0.15)))
  )
  (fp_text value VAL** (at -0.25 -5.25) (layer F.SilkS)
    (effects (font (size 1.5 1.5) (thickness 0.15)))
  )
  (fp_line (start -6.75 8.75) (end -6.75 -9.75) (layer F.SilkS) (width 0.15))
  (fp_line (start -6.75 -9.75) (end 6.75 -9.75) (layer F.SilkS) (width 0.15))
  (fp_line (start 6.75 -9.75) (end 6.75 8.75) (layer F.SilkS) (width 0.15))
  (fp_line (start 6.75 8.75) (end -6.75 8.75) (layer F.SilkS) (width 0.15))
  (pad 8 smd rect (at -6.75 7.75) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 6.75 7.75) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 6.75 6.25) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 6.75 4.75) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 6.75 3.25) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 6.75 1.75) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 6.75 0.25) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 6.75 -1.25) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 6.75 -2.75) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd rect (at -6.75 -2.75) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -6.75 -1.25) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -6.75 0.25) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -6.75 1.75) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -6.75 3.25) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -6.75 4.75) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -6.75 6.25) (size 1 0.9) (layers F.Cu F.Paste F.Mask))
)