- PCB and stencil: Aisler 4-layer
- Stencil registration tool: Eurocrictuis ec manual tool
- Tools for pick&place: VAC-12000 vacuum pickup, SWIFT S41-20 Binocular Stereo Microscope
- Solder paste: Chipquik NC191SNL50T5 (Sn96.5/Ag3.0/Cu0.5, 217..220 °C melting point, no-clean flux, T5 / 15-25 microns)
- Vapor phase liquid: Galden HS240 (240 °C boiling point)
The key component, the HMC602LP4E RF power sensor, was discontinued shortly after I started the project.
There is no pin-compatible replacement, but ADI recommends the AD8318 as a replacement. At a first glance, it looks like it could be used with only small PCB modifications. However, it has a different pitch (0.65 mm vs. 0.5 mm), so the pad geometry may have to be adjusted.