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+
+# 3.12.0 Firmware for Bondtech Prusa i3 MK25 / MK3,  MK25s / MK3s and MK25s / MK3s Mosquito
+
+2023-01-16
+
+Compiled firmware to support Bondtech Prusa i3 MK25 / MK3, MK25s / MK3s, MK25s / MK3s Mosquito and Bondtech LGX for MK3s & Mosquito
+
+Firmware based on Prusa's latest release with adjustments to support bondtech extruders. Please read Prusa's release note for all changes in the new release: https://github.com/prusa3d/Prusa-Firmware/releases/tag/v3.12.0
+
+# 3.12.0 Summary Bondtech specific changes
+
+- Adjusted Load/Unload filament sequence.
+- MK3/MK3s: Variants for Slice Engineering's High temperature thermistor (SE_HT-thermistor).
+- MK3/MK3s: Changed microstep resolution to 16.
+- MK3s/MK25s: Correct Z_MAX_POS adjustments to allow XYZ Calibration.
+- MK3s/Mk25s: Adjusted mmu.cpp to correct values for E3Dv6, Mosquito and Mosquito Magnum together with the Bondtech extruder when preforming can_load and mmu_load_to_nozzle.
+- Full speed enabled for custom fans.
+
+Source Code: https://github.com/BondtechAB/Bondtech-Prusa-Firmware