diff --git a/Firmware/3.14.1/README.md b/Firmware/3.14.1/README.md
index d53f6d2..2211f6d 100644
--- a/Firmware/3.14.1/README.md
+++ b/Firmware/3.14.1/README.md
@@ -1,13 +1,13 @@
 
-# 3.14.0 Firmware for Bondtech Prusa i3 MK25 / MK3,  MK25s / MK3s and MK25s / MK3s Mosquito
+# 3.14.1 Firmware for Bondtech Prusa i3 MK25 / MK3,  MK25s / MK3s and MK25s / MK3s Mosquito
 
-2024-07-30
+2024-12-09
 
 Compiled firmware to support Bondtech Prusa i3 MK25 / MK3, MK25s / MK3s, MK25s / MK3s Mosquito and Bondtech LGX for MK3s & Mosquito
 
-Firmware based on Prusa's latest release with adjustments to support bondtech extruders. Please read Prusa's release note for all changes in the new release: https://github.com/prusa3d/Prusa-Firmware/releases/tag/v3.14.0
+Firmware based on Prusa's latest release with adjustments to support bondtech extruders. Please read Prusa's release note for all changes in the new release: https://github.com/prusa3d/Prusa-Firmware/releases/tag/v3.14.1
 
-# 3.14.0 Summary Bondtech specific changes
+# 3.14.1 Summary Bondtech specific changes
 
 - Adjusted Load/Unload filament sequence.
 - MK3/MK3s: Variants for Slice Engineering's High temperature thermistor (SE_HT-thermistor), E3DRevo.